PSI’s Continuous Clip Plating Systems are designed to build-up (plate) metal on metallized thin film substrates, such as mylar and kapton.

Outstanding Features:

• Unique clip design eliminates tension on the substrate.
• High efficiency power contact design minimizes voltage loss.
• Improved coated clips prevent metal build-up on the contact points of the clips.
• Overhead clip location allows easy maintenance and change out.
• Polypropylene cam automatically opens clips in rinse stations to rinse the clip contact area.
• Clips automatically change contact points by releasing and reattaching at different points, to prevent burn-off of patterns on the substrate.